View STK11C68_4790074.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

STK11C68
64 Kbit (8K x 8) SoftStore nvSRAM
Features

Functional Description
The Cypress STK11C68 is a 64Kb fast static RAM with a nonvolatile element in each memory cell. The embedded nonvolatile elements incorporate QuantumTrap technology producing the world's most reliable nonvolatile memory. The SRAM provides unlimited read and write cycles, while independent nonvolatile data resides in the highly reliable QuantumTrap cell. Data transfers under software control from SRAM to the nonvolatile elements (the STORE operation). On power up, data is automatically restored to the SRAM (the RECALL operation) from the nonvolatile memory. RECALL operations are also available under software control.
25 ns, 35 ns, and 45 ns access times Pin compatible with industry standard SRAMs Software initiated nonvolatile STORE Unlimited Read and Write endurance Automatic RECALL to SRAM on power up Unlimited RECALL cycles 1,000,000 STORE cycles 100 year data retention Single 5V+10% operation Commercial and industrial temperature 28-pin (330 mil) SOIC package 28-pin (300 mil) CDIP and 28-pad (350 mil) LCC packages RoHS compliance
Logic Block Diagram
A5
Quantum Trap 128 X 512 STORE
V CC
V CAP
A7 A8 A9 A 11 A 12
ROW DECODER
A6
POWER CONTROL STORE/ RECALL CONTROL
STATIC RAM ARRAY 128 X 512
RECALL
HSB
SOFTWARE DETECT COLUMN I/O
A0
- A 12
DQ 0 DQ 2 DQ 3 DQ 4 DQ 5 DQ 6 DQ 7
INPUT BUFFERS
DQ 1
COLUMN DEC
A 0 A 1 A 2 A 3 A 4 A 10
OE
CE WE
Cypress Semiconductor Corporation Document Number: 001-50638 Rev. **
*
198 Champion Court
*
San Jose, CA 95134-1709 * 408-943-2600 Revised January 30, 2009
[+] Feedback
STK11C68
Pin Configurations
Figure 1. Pin Diagram - 28-Pin SOIC/DIP and 28-Pin LLC
Pin Definitions
Pin Name A0-A12 DQ0-DQ7 WE CE OE VSS VCC W E G Alt IO Type Input Input or Output Input Input Input Ground Description Address Inputs. Used to select one of the 8,192 bytes of the nvSRAM. Bidirectional Data IO Lines. Used as input or output lines depending on operation. Write Enable Input, Active LOW. When the chip is enabled and WE is LOW, data on the IO pins is written to the specific address location. Chip Enable Input, Active LOW. When LOW, selects the chip. When HIGH, deselects the chip. Output Enable, Active LOW. The active LOW OE input enables the data output buffers during read cycles. Deasserting OE HIGH causes the IO pins to tri-state. Ground for the Device. The device is connected to ground of the system.
Power Supply Power Supply Inputs to the Device.
Document Number: 001-50638 Rev. **
Page 2 of 16
[+] Feedback
STK11C68
Device Operation
The STK11C68 is a versatile memory chip that provides several modes of operation. The STK16C88 can operate as a standard 8K x 8 SRAM. A 8K x 8 array of nonvolatile storage elements shadow the SRAM. SRAM data can be copied nonvolatile memory or nonvolatile data can be recalled to the SRAM. not necessary that OE is LOW for a valid sequence. After the tSTORE cycle time is fulfilled, the SRAM is again activated for Read and Write operation.
Software RECALL
Data is transferred from the nonvolatile memory to the SRAM by a software address sequence. A software RECALL cycle is initiated with a sequence of Read operations in a manner similar to the software STORE initiation. To initiate the RECALL cycle, the following sequence of CE controlled Read operations is performed: 1. Read address 0x0000, Valid READ 2. Read address 0x1555, Valid READ 3. Read address 0x0AAA, Valid READ 4. Read address 0x1FFF, Valid READ 5. Read address 0x10F0, Valid READ 6. Read address 0x0F0E, Initiate RECALL cycle Internally, RECALL is a two step procedure. First, the SRAM data is cleared; then, the nonvolatile information is transferred into the SRAM cells. After the tRECALL cycle time, the SRAM is again ready for Read and Write operations. The RECALL operation does not alter the data in the nonvolatile elements. The nonvolatile data can be recalled an unlimited number of times.
SRAM Read
The STK11C68 performs a Read cycle whenever CE and OE are LOW while WE is HIGH. The address specified on pins A0-12 determines the 8,192 data bytes accessed. When the Read is initiated by an address transition, the outputs are valid after a delay of tAA (Read cycle 1). If the Read is initiated by CE or OE, the outputs are valid at tACE or at tDOE, whichever is later (Read cycle 2). The data outputs repeatedly respond to address changes within the tAA access time without the need for transitions on any control input pins, and remains valid until another address change or until CE or OE is brought HIGH, or WE brought LOW.
SRAM Write
A Write cycle is performed whenever CE and WE are LOW. The address inputs must be stable prior to entering the Write cycle and must remain stable until either CE or WE goes HIGH at the end of the cycle. The data on the common IO pins DQ0-7 are written into the memory if it has valid tSD, before the end of a WE controlled Write or before the end of an CE controlled Write. Keep OE HIGH during the entire Write cycle to avoid data bus contention on common IO lines. If OE is left LOW, internal circuitry turns off the output buffers tHZWE after WE goes LOW.
Hardware RECALL (Power Up)
During power up or after any low power condition (VCC < VRESET), an internal RECALL request is latched. When VCC once again exceeds the sense voltage of VSWITCH, a RECALL cycle is automatically initiated and takes tHRECALL to complete. If the STK11C68 is in a Write state at the end of power up RECALL, the SRAM data is corrupted. To help avoid this situation, a 10 Kohm resistor is connected either between WE and system VCC or between CE and system VCC.
Software STORE
Data is transferred from the SRAM to the nonvolatile memory by a software address sequence. The STK11C68 software STORE cycle is initiated by executing sequential CE controlled Read cycles from six specific address locations in exact order. During the STORE cycle, an erase of the previous nonvolatile data is first performed followed by a program of the nonvolatile elements. When a STORE cycle is initiated, input and output are disabled until the cycle is completed. Because a sequence of Reads from specific addresses is used for STORE initiation, it is important that no other Read or Write accesses intervene in the sequence. If they intervene, the sequence is aborted and no STORE or RECALL takes place. To initiate the software STORE cycle, the following Read sequence is performed: 1. Read address 0x0000, Valid READ 2. Read address 0x1555, Valid READ 3. Read address 0x0AAA, Valid READ 4. Read address 0x1FFF, Valid READ 5. Read address 0x10F0, Valid READ 6. Read address 0x0F0F, Initiate STORE cycle The software sequence is clocked with CE controlled Reads. When the sixth address in the sequence is entered, the STORE cycle commences and the chip is disabled. It is important that Read cycles and not Write cycles are used in the sequence. It is Document Number: 001-50638 Rev. **
Hardware Protect
The STK11C68 offers hardware protection against inadvertent STORE operation and SRAM Writes during low voltage conditions. When VCAPNoise Considerations
The STK11C68 is a high speed memory. It must have a high frequency bypass capacitor of approximately 0.1 F connected between VCC and VSS, using leads and traces that are as short as possible. As with all high speed CMOS ICs, careful routing of power, ground, and signals reduce circuit noise.
Low Average Active Power
CMOS technology provides the STK11C68 the benefit of drawing significantly less current when it is cycled at times longer than 50 ns. Figure 2 shows the relationship between ICC and Read or Write cycle time. Worst case current consumption is shown for both CMOS and TTL input levels (commercial temperature range, VCC = 5.5V, 100% duty cycle on chip enable). Only standby current is drawn when the chip is disabled. The overall
Page 3 of 16
[+] Feedback
STK11C68
average current drawn by the STK11C68 depends on the following items:

Best Practices
nvSRAM products have been used effectively for over 15 years. While ease of use is one of the product's main system values, experience gained working with hundreds of applications has resulted in the following suggestions as best practices:
The duty cycle of chip enable The overall cycle rate for accesses The ratio of Reads to Writes CMOS versus TTL input levels The operating temperature The VCC level
IO loading Figure 2. Current Versus Cycle Time (Read)
The nonvolatile cells in an nvSRAM are programmed on the test floor during final test and quality assurance. Incoming inspection routines at customer or contract manufacturer's sites sometimes reprograms these values. Final NV patterns are typically repeating patterns of AA, 55, 00, FF, A5, or 5A. The end product's firmware should not assume that an NV array is in a set programmed state. Routines that check memory content values to determine first time system configuration, cold or warm boot status, and so on must always program a unique NV pattern (for example, complex 4-byte pattern of 46 E6 49 53 hex or more random bytes) as part of the final system manufacturing test to ensure these system routines work consistently. Power up boot firmware routines should rewrite the nvSRAM into the desired state. While the nvSRAM is shipped in a preset state, best practice is to again rewrite the nvSRAM into the desired state as a safeguard against events that might flip the bit inadvertently (program bugs, incoming inspection routines, and so on).
Figure 3. Current Versus Cycle Time (Write)
Table 1. Hardware Mode Selection CE L WE H A12-A0 0x0000 0x1555 0x0AAA 0x1FFF 0x10F0 0x0F0F 0x0000 0x1555 0x0AAA 0x1FFF 0x10F0 0x0F0E Mode Read SRAM Read SRAM Read SRAM Read SRAM Read SRAM Nonvolatile STORE Read SRAM Read SRAM Read SRAM Read SRAM Read SRAM Nonvolatile RECALL IO Output Data Output Data Output Data Output Data Output Data Output High Z Output Data Output Data Output Data Output Data Output Data Output High Z Notes
[1]
L
H
[1]
Note 1. The six consecutive addresses must be in the order listed. WE must be high during all six consecutive CE controlled cycles to enable a nonvolatile cycle.
Document Number: 001-50638 Rev. **
Page 4 of 16
[+] Feedback
STK11C68
Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the device. These user guidelines are not tested. Storage Temperature ................................. -65C to +150C Temperature under bias.............................. -55C to +125C Supply Voltage on VCC Relative to GND ..........-0.5V to 7.0V Voltage on Input Relative to Vss............ -0.6V to VCC + 0.5V Voltage on DQ0-7 ...................................-0.5V to Vcc + 0.5V Range Commercial Industrial Power Dissipation ......................................................... 1.0W DC Output Current (1 output at a time, 1s duration).... 15 mA
Operating Range
Ambient Temperature 0C to +70C -40C to +85C VCC 4.5V to 5.5V 4.5V to 5.5V
DC Electrical Characteristics
Over the operating range (VCC = 4.5V to 5.5V) Parameter ICC1 Description Average VCC Current Test Conditions tRC = 25 ns tRC = 35 ns tRC = 45 ns Dependent on output loading and cycle rate. Values obtained without output loads. IOUT = 0 mA. All Inputs Do Not Care, VCC = Max Average current for duration tSTORE Commercial Min Max 90 75 65 90 75 65 3 10 Unit mA mA mA mA mA mA mA mA
Industrial
ICC2 ICC3 ISB1[2]
Average VCC Current during STORE
Average VCC Current at WE > (VCC - 0.2V). All other inputs cycling. tRC= 200 ns, 5V, 25C Dependent on output loading and cycle rate. Values obtained Typical without output loads. VCC Standby Current (Standby, Cycling TTL Input Levels) tRC = 25 ns, CE > VIH tRC = 35 ns, CE > VIH tRC = 45 ns, CE > VIH Commercial
27 23 20 28 24 21 750 1500 -1 -5 2.2 VSS - 0.5 +1 +5 VCC + 0.5 0.8 0.4
mA mA mA mA mA mA A A A A V V V V
Industrial
ISB2 [2]
VCC Standby Current
CE > (VCC - 0.2V). All others VIN < 0.2V or > Commercial (VCC - 0.2V). Standby current level after nonvolatile cycle is complete. Industrial Inputs are static. f = 0 MHz. VCC = Max, VSS < VIN < VCC, CE or OE > VIH or WE < VIL
IIX IOZ VIH VIL VOH VOL
Input Leakage Current VCC = Max, VSS < VIN < VCC Off State Output Leakage Current Input HIGH Voltage Input LOW Voltage Output HIGH Voltage Output LOW Voltage IOUT = -4 mA IOUT = 8 mA
2.4
Data Retention and Endurance
Parameter DATAR NVC Data Retention Nonvolatile STORE Operations Description Min 100 1,000 Unit Years K
Note 2. CE > VIH does not produce standby current levels until any nonvolatile cycle in progress has timed out.
Document Number: 001-50638 Rev. **
Page 5 of 16
[+] Feedback
STK11C68
Capacitance
Parameter CIN COUT
In the following table, the capacitance parameters are listed.[3] Description Input Capacitance Output Capacitance TA = 25C, f = 1 MHz, VCC = 0 to 3.0V Test Conditions Max 8 7 Unit pF pF
Thermal Resistance
Parameter
In the following table, the thermal resistance parameters are listed.[3] Description Thermal Resistance (Junction to Ambient) Thermal Resistance (Junction to Case) Test Conditions Test conditions follow standard test methods and procedures for measuring thermal impedance, per EIA / JESD51. 28-SOIC TBD TBD 28-CDIP TBD TBD 28-LCC TBD TBD Unit C/W C/W
JA JC
Figure 4. AC Test Loads R1 480 5.0V Output 30 pF R2 255
AC Test Conditions
Input Pulse Levels .................................................... 0V to 3V Input Rise and Fall Times (10% to 90%) ...................... <5 ns Input and Output Timing Reference Levels .................... 1.5V
Note 3. These parameters are guaranteed by design and are not tested.
Document Number: 001-50638 Rev. **
Page 6 of 16
[+] Feedback
STK11C68
AC Switching Characteristics
SRAM Read Cycle
Parameter Cypress Alt Parameter tELQV tACE tAVAV, tELEH tRC [4] tAVQV tAA [5] tGLQV tDOE tAXQX tOHA [5] tELQX tLZCE [6] tEHQZ tHZCE [6] [6] tGLQX tLZOE tGHQZ tHZOE [6] tELICCH tPU [3] [3] tEHICCL tPD 25 ns Description Chip Enable Access Time Read Cycle Time Address Access Time Output Enable to Data Valid Output Hold After Address Change Chip Enable to Output Active Chip Disable to Output Inactive Output Enable to Output Active Output Disable to Output Inactive Chip Enable to Power Active Chip Disable to Power Standby Min Max 25 25 25 10 5 5 10 0 10 0 25 0 35 0 13 0 45 5 5 13 0 15 35 35 15 5 5 15 35 ns Min Max 35 45 45 20 45 ns Min Max 45 Unit ns ns ns ns ns ns ns ns ns ns ns
Switching Waveforms
Figure 5. SRAM Read Cycle 1: Address Controlled [4, 5]
Figure 6. SRAM Read Cycle 2: CE and OE Controlled [4]
Notes 4. WE must be High during SRAM Read cycles. 5. I/O state assumes CE and OE < VIL and WE > VIH; device is continuously selected. 6. Measured 200 mV from steady state output voltage.
Document Number: 001-50638 Rev. **
Page 7 of 16
[+] Feedback
STK11C68
SRAM Write Cycle
Parameter Cypress Parameter tWC tPWE tSCE tSD tHD tAW tSA tHA tHZWE [6,7] tLZWE [6] Alt tAVAV tWLWH, tWLEH tELWH, tELEH tDVWH, tDVEH tWHDX, tEHDX tAVWH, tAVEH tAVWL, tAVEL tWHAX, tEHAX tWLQZ tWHQX Description Write Cycle Time Write Pulse Width Chip Enable To End of Write Data Setup to End of Write Data Hold After End of Write Address Setup to End of Write Address Setup to Start of Write Address Hold After End of Write Write Enable to Output Disable Output Active After End of Write 25 ns Min 25 20 20 10 0 20 0 0 10 5 5 Max 35 ns Min 35 25 25 12 0 25 0 0 13 5 Max 45 ns Min 45 30 30 15 0 30 0 0 15 Max Unit ns ns ns ns ns ns ns ns ns ns
Switching Waveforms
Figure 7. SRAM Write Cycle 1: WE Controlled [7, 8]
tWC
ADDRESS
tSCE
CE
tHA
tAW tSA
WE
tPWE tSD tHD
DATA IN
DATA VALID
tHZWE
DATA OUT PREVIOUS DATA
HIGH IMPEDANCE
tLZWE
Figure 8. SRAM Write Cycle 2: CE and OE Controlled [7, 8]
tWC
ADDRESS
CE
tSA tAW tPWE
tSCE
tHA
WE
tSD
DATA IN DATA VALID
tHD
DATA OUT
HIGH IMPEDANCE
Notes 7. If WE is Low when CE goes Low, the outputs remain in the high impedance state. 8. CE or WE must be greater than VIH during address transitions.
Document Number: 001-50638 Rev. **
Page 8 of 16
[+] Feedback
STK11C68
AutoStore INHIBIT or Power Up RECALL
Parameter tHRECALL [9] tSTORE VSWITCH VRESET Alt tRESTORE tHLHZ Description Power up RECALL Duration STORE Cycle Duration Low Voltage Trigger Level Low Voltage Reset Level Min STK11C68 Max 550 10 4.0 4.5 3.6 Unit s ms V V
Switching Waveform
Figure 9. AutoStore INHIBIT/Power Up RECALL
VCC
5V VSWITCH VRESET
STORE INHIBIT
POWER-UP RECALL tHRECALL DQ (DATA OUT)
POWER-UP RECALL
BROWN OUT STORE INHIBIT NO RECALL (VCC DID NOT GO BELOW VRESET)
BROWN OUT STORE INHIBIT NO RECALL (VCC DID NOT GO BELOW VRESET)
BROWN OUT STORE INHIBIT RECALL WHEN VCC RETURNS ABOVE VSWITCH
Note 9. tHRECALL starts from the time VCC rises above VSWITCH.
Document Number: 001-50638 Rev. **
Page 9 of 16
[+] Feedback
STK11C68
Software Controlled STORE/RECALL Cycle
The software controlled STORE/RECALL cycle follows. [10, 11] Parameter tRC tSA
[10]
Alt tAVAV tAVEL tELEH tELAX
Description STORE/RECALL Initiation Cycle Time Address Setup Time Clock Pulse Width Address Hold Time RECALL Duration
25 ns Min 25 0 20 20 20 Max 35 0 25 20
35 ns Min Max 45 0 30 20 20
45 ns Min Max
Unit ns ns ns ns
tCW[10] tHACE[10] tRECALL[10]
20
s
Switching Waveform
Figure 10. CE Controlled Software STORE/RECALL Cycle [11]
tRC
ADDRESS ADDRESS # 1
tRC
ADDRESS # 6
tSA
CE
tSCE
tHACE
OE
t STORE / t RECALL
DQ (DATA) DATA VALID DATA VALID
HIGH IMPEDANCE
Notes 10. The software sequence is clocked on the falling edge of CE without involving OE (double clocking aborts the sequence). 11. The six consecutive addresses must be read in the order listed in Table 1 on page 4. WE must be HIGH during all six consecutive cycles.
Document Number: 001-50638 Rev. **
Page 10 of 16
[+] Feedback
STK11C68
Part Numbering Nomenclature STK11C68 - S F 45 I TR
Packaging Option: TR = Tape and Reel Blank = Tube
Temperature Range: Blank - Commercial (0 to 70C) I - Industrial (-40 to 85C)
Lead Finish F = 100% Sn (Matte Tin) Package: S = Plastic 28-pin 330 mil SOIC C = Ceramic 28-pin 300 mil DIP L = Ceramic 28-pin 350 mil LLC
Speed: 25 - 25 ns 35 - 35 ns 45 - 45 ns
Ordering Information
Speed (ns) 25 Ordering Code STK11C68-SF25TR STK11C68-SF25 STK11C68-SF25ITR STK11C68-SF25I 35 STK11C68-SF35TR STK11C68-SF35 STK11C68-C35 STK11C68-L35 STK11C68-SF35ITR STK11C68-SF35I STK11C68-C35I STK11C68-L35I Package Diagram 001-85058 001-85058 001-85058 001-85058 001-85058 001-85058 001-51695 001-51696 001-85058 001-85058 001-51695 001-51696 Package Type 28-Pin SOIC (330 mil) 28-Pin SOIC (330 mil) 28-Pin SOIC (330 mil) 28-Pin SOIC (330 mil) 28-Pin SOIC (330 mil) 28-Pin SOIC (330 mil) 28-Pin CDIP (300 mil) 28-Pin LCC (350 mil) 28-Pin SOIC (330 mil) 28-Pin SOIC (330 mil) 28-Pin CDIP (300 mil) 28-Pin LCC (350 mil) Industrial Commercial Industrial Operating Range Commercial
Document Number: 001-50638 Rev. **
Page 11 of 16
[+] Feedback
STK11C68
Ordering Information (continued)
Speed (ns) 45 Ordering Code STK11C68-SF45TR STK11C68-SF45 STK11C68-C45 STK11C68-L45 STK11C68-SF45ITR STK11C68-SF45I STK11C68-C45I STK11C68-L45I Package Diagram 001-85058 001-85058 001-51695 001-51696 001-85058 001-85058 001-51695 001-51696 Package Type 28-Pin SOIC (330 mil) 28-Pin SOIC (330 mil) 28-Pin CDIP (300 mil) 28-Pin LCC (350 mil) 28-Pin SOIC (330 mil) 28-Pin SOIC (330 mil) 28-Pin CDIP (300 mil) 28-Pin LCC (350 mil) Industrial Operating Range Commercial
All parts are Pb-free. The above table contains Final information. Contact your local Cypress sales representative for availability of these parts
Document Number: 001-50638 Rev. **
Page 12 of 16
[+] Feedback
STK11C68
Package Diagrams
Figure 11. 28-Pin (330 Mil) SOIC (51-85058)
51-85058 *A
Document Number: 001-50638 Rev. **
Page 13 of 16
[+] Feedback
STK11C68
Package Diagrams (continued)
Figure 12. 28-Pin (300 Mil) Side Braze DIL (001-51695)
001-51695 **
Document Number: 001-50638 Rev. **
Page 14 of 16
[+] Feedback
STK11C68
Package Diagrams (continued)
Figure 13. 28-Pad (350 Mil) LCC (001-51696)
1. ALL DIMENSION ARE IN INCHES AND MILLIMETERS [MIN/MAX] 2. JEDEC 95 OUTLINE# MO-041 3. PACKAGE WEIGHT : TBD
001-51696 **
Document Number: 001-50638 Rev. **
Page 15 of 16
[+] Feedback
STK11C68
Document History Page
Document Title: STK11C68 64 Kbit (8K x 8) SoftStore nvSRAM Document Number: 001-50638 Rev. ** ECN No. 2625084 Orig. of Change GVCH/PYRS Submission Date 01/30/09 New data sheet Description of Change
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer's representatives, and distributors. To find the office closest to you, visit us at cypress.com/sales.
Products
PSoC Clocks & Buffers Wireless Memories Image Sensors psoc.cypress.com clocks.cypress.com wireless.cypress.com memory.cypress.com image.cypress.com
PSoC Solutions
General Low Power/Low Voltage Precision Analog LCD Drive CAN 2.0b USB psoc.cypress.com/solutions psoc.cypress.com/low-power psoc.cypress.com/precision-analog psoc.cypress.com/lcd-drive psoc.cypress.com/can psoc.cypress.com/usb
(c) Cypress Semiconductor Corporation, 2009. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress' product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 001-50638 Rev. **
Revised January 30, 2009
Page 16 of 16
AutoStore and QuantumTrap are registered trademarks of Cypress Semiconductor Corporation. All products and company names mentioned in this document may be the trademarks of their respective holders.
[+] Feedback

▲Up To Search▲

Price & Availability of STK11C68

	To Download STK11C68 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .